Hot runner systems for thin wall packaging

Our hot runner systems for thin wall packaging – such as food bowls and containers – are designed to withstand high injection pressures and to reduce the cycle time.

For an excellent part quality and an optimal cycle time, our hot runner systems are equipped with in-house conforming cooling circuits using SLM Technology (Selective Laser Melting).

The multi-cavity systems by Oerlikon HRSflow are conceived for all components requiring high production volumes. Our hot runner solutions comply with the new environmental standards for packaging which require the production system to be more energy-efficient.

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