Join us at Plastpol 2021 and discover our new hot runner system series for small injection molded parts!
Available at the booth, our advanced solutions for pin control: FLEXflow Evo Technology and the new Mechanical Stroke Regulator.
The exhibition will take place from 21 to 23 September in Kielce (Poland).
Suitable mainly for technical materials, the S Series is the compact solution allowing a reduced pitch. The new Line can be equipped with screwed-in or non-screwed-in (face-to-face) nozzles depending on the desired application.
Developed for the production of consumer goods, technical and electronic parts, it is the ideal hot runner series for:
In addition, the new compact Series enables the production of small automotive parts such as:
At Plastpol 2021, we will be demonstrating several applications of our S Series. Among the parts on display, the special “Hydration Reminder” for glasses made of PP. The smart device can be placed on any bottle or glass and it can easily register every single sip. The main requirements for the production of the tracker? A low part weight of only 1 mm thickness and a fast color change.
At Plastpol 2021, we will showcase the family mold for one-shot production of three high-quality visible parts for a door module for car interiors. The use of the FLEXflow Evo technology ensures flawless, finely grained surfaces without pressure lines or flow marks even though these parts differ considerably from one another in terms of their dimensions and volumes.
The new Mechanical Stroke Regulator allows in an easy way to mechanically adjust the opening position of the pin at a fixed value managing the volume of the oil which feeds the hydraulic actuators. The control of the opening pin position allows to adjust the pressure drop for each nozzle, independently, managing the flow rate during the filling phase and the pressure distribution during the packing phase.
HRScool Evo is the innovative solution for cylinders where water lines are not required anymore. A telescopic cover, made of a highly conductive material and placed between the cylinder and the plate, makes thermal bridge with the back plate to ease the heat dissipation. Thanks to the new geometry of the components and a new gasket, HRScool Evo enlarges the range of applications where the active cooling can be avoided.
Do you want to know more? We look forward to meeting you at our booth E95, Hall E.