12.10.2021 - 16.10.2021
Oerlikon HRSflow at Fakuma 2021

From October 12 to 16, visit us at Hall A2 Booth 2217

 

At Fakuma 2021 (Hall A2 Booth A2-2217) we will be presenting the new cylinder and nozzle range for small applications. Among the advanced pin control solutions available at our booth, the FLEXflow Evo Technology and its most promising application trends including family molds and back-injection of films.

New S Series for small pitch

Depending on the application, the new S series can be equipped with screwed-in or non-screwed-in (face-to-face) nozzles. The inner bore size can be selected according to the shot weight. The design allows a compact mould structure with a minimum nozzle pitch of 37 mm. In the valve gate version, the S-series is combined with either a compact cylinder 62 mm high or, in the version with adjustable needle position, with a 70 mm high cylinder. Extensive internal laboratory tests have ensured an optimal sealing and thermal profile along the whole nozzle. In addition, a special channel geometry enables fast colour changes.

The new S series is suitable for:

  • low shot weights
  • multi-cavity moulds 
  • thin-walled components

Typical applications include consumer goods, technical and electronic components as well as small automotive parts such as emblems, interior switches, knobs for sound systems or air conditioning components.

At Fakuma, we will showcase the application of the new S series for a so-called Hydration Reminder made of polypropylene (PP). Attached to bottles or glasses, it reminds the user by signal to drink regularly. The S series made it possible to meet the requirements for a low part weight with a wall thickness of only 1 mm as well as for quick colour changes. 


The most promising application trends for FLEXflow Evo hot runner technology

The most promising application trends for FLEXflow Evo - the servo driven valve gate systems from Oerlikon HRSflow – include family molds and the back-injection of films.

At Fakuma 2021, we will showcase the family mold for one-shot production of three high-quality visible parts for a door module for car interiors. The use of the FLEXflow Evo technology ensures flawless, finely grained surfaces without pressure lines or flow marks even though these parts differ considerably from one another in terms of their dimensions and volumes. 

Film back-injection with capacitive films is a forward-looking technology that is only just beginning to develop. It enables, for example, the integration of functional elements with a low thickness, such as lights, sensors or touch switches, and thus provides a previously unknown level of design flexibility, especially for automotive interior and exterior applications with grained or high-gloss Class A surfaces.


The New HRScool Evo

HRScool Evo is the innovative solution for cylinders where water lines are not required anymore. Designed for thermal insulation optimization, it avoids cooling for the most common automotive applications. A telescopic cover, made of a highly conductive material and placed between the cylinder and the plate, makes thermal bridge with the back plate to ease the heat dissipation.
Thanks to the new geometry of the components, HRScool Evo enlarges the range of applications where the active cooling can be avoided. 

Among the main benefits:

  • Wider process window compared to the previous HRScool
  • Thermal insulation optimization, no active cooling required
  • Easy maintenance: no issues associated with clogged cooling circuits
  • Compact solution that allows to contain the cutout of the mold
  • No degradation of the hydraulic fluid
  • Optimal thermal uniformity along the whole hot runner system, thanks to insulation concept used